AM27S07APC vs CY27S03DC feature comparison

AM27S07APC AMD

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CY27S03DC Rochester Electronics LLC

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC ROCHESTER ELECTRONICS LLC
Part Package Code DIP
Package Description DIP, DIP16,.3 DIP,
Pin Count 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 35 ns
JESD-30 Code R-PDIP-T16 R-GDIP-T16
JESD-609 Code e0
Length 19.05 mm 19.431 mm
Memory Density 64 bit 64 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Ports 1
Number of Terminals 16 16
Number of Words 16 words 16 words
Number of Words Code 16 16
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 70 °C
Operating Temperature-Min
Organization 16X4 16X4
Output Characteristics 3-STATE
Output Enable NO
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL CMOS
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 4 1
Additional Feature INVERTED OUTPUT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare CY27S03DC with alternatives