AM2964B/BQA
vs
AM2964BXC
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
DIP
|
DIE
|
| Package Description |
DIP, DIP40,.6
|
DIE, DIE OR CHIP
|
| Pin Count |
40
|
40
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
16
|
16
|
| Boundary Scan |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-GDIP-T40
|
R-XUUC-N40
|
| JESD-609 Code |
e0
|
|
| Length |
52.2605 mm
|
|
| Low Power Mode |
NO
|
NO
|
| Memory Organization |
176K X 8
|
176K X 8
|
| Number of Banks |
4
|
4
|
| Number of Terminals |
40
|
40
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
UNSPECIFIED
|
| Package Code |
DIP
|
DIE
|
| Package Equivalence Code |
DIP40,.6
|
DIE OR CHIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
UNCASED CHIP
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Seated Height-Max |
5.588 mm
|
|
| Supply Current-Max |
164 mA
|
173 mA
|
| Supply Voltage-Max |
5.5 V
|
5.25 V
|
| Supply Voltage-Min |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Width |
15.24 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MEMORY CONTROLLER, DRAM
|
MEMORY CONTROLLER, DRAM
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare AM2964B/BQA with alternatives
Compare AM2964BXC with alternatives