AM2964BDC vs 2964B feature comparison

AM2964BDC AMD

Buy Now Datasheet

2964B Philips Semiconductors

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SIGNETICS CORP
Part Package Code DIP
Package Description DIP, DIP40,.6 ,
Pin Count 40
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 16
Boundary Scan NO
External Data Bus Width
JESD-30 Code R-GDIP-T40 R-XDIP-T40
JESD-609 Code e0
Length 52.2605 mm
Low Power Mode NO
Memory Organization 176K X 8
Number of Banks 4
Number of Terminals 40 40
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material CERAMIC, GLASS-SEALED UNSPECIFIED
Package Code DIP
Package Equivalence Code DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.588 mm
Supply Current-Max 173 mA
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
uPs/uCs/Peripheral ICs Type MEMORY CONTROLLER, DRAM MEMORY CONTROLLER, DRAM
Base Number Matches 2 4

Compare AM2964BDC with alternatives

Compare 2964B with alternatives