AM2964BXC vs 54F411DMQB feature comparison

AM2964BXC AMD

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54F411DMQB Fairchild Semiconductor Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC FAIRCHILD SEMICONDUCTOR CORP
Part Package Code DIE DIP
Package Description DIE, DIE OR CHIP DIP, DIP40,.6
Pin Count 40 40
Reach Compliance Code compliant unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 16 14
Boundary Scan NO NO
External Data Bus Width 3
JESD-30 Code R-XUUC-N40 R-CDIP-T40
Low Power Mode NO NO
Memory Organization 176K X 8
Number of Banks 4
Number of Terminals 40 40
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code DIE DIP
Package Equivalence Code DIE OR CHIP DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Current-Max 173 mA 190 mA
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
uPs/uCs/Peripheral ICs Type MEMORY CONTROLLER, DRAM MEMORY CONTROLLER, FIFO
Base Number Matches 1 1
Rohs Code No
ECCN Code 3A001.A.2.C
JESD-609 Code e0
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.21 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 15.24 mm

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Compare 54F411DMQB with alternatives