AM2964BXC
vs
AM2964BPC
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
DIE
|
DIP
|
Package Description |
DIE, DIE OR CHIP
|
DIP, DIP40,.6
|
Pin Count |
40
|
40
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
16
|
16
|
Boundary Scan |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
R-XUUC-N40
|
R-PDIP-T40
|
Low Power Mode |
NO
|
NO
|
Memory Organization |
176K X 8
|
176K X 8
|
Number of Banks |
4
|
4
|
Number of Terminals |
40
|
40
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
DIE
|
DIP
|
Package Equivalence Code |
DIE OR CHIP
|
DIP40,.6
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Current-Max |
173 mA
|
173 mA
|
Supply Voltage-Max |
5.25 V
|
5.25 V
|
Supply Voltage-Min |
4.75 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
Terminal Position |
UPPER
|
DUAL
|
uPs/uCs/Peripheral ICs Type |
MEMORY CONTROLLER, DRAM
|
MEMORY CONTROLLER, DRAM
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Length |
|
52.324 mm
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Seated Height-Max |
|
5.715 mm
|
Terminal Pitch |
|
2.54 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Width |
|
15.24 mm
|
|
|
|
Compare AM2964BXC with alternatives
Compare AM2964BPC with alternatives