AM29C01/BQA vs MAS2901CB feature comparison

AM29C01/BQA Rochester Electronics LLC

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MAS2901CB Dynex Semiconductor

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC GEC PLESSEY SEMICONDUCTORS
Package Description DIP, DIP, DIP40,.6
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
Clock Frequency-Max 31.25 MHz 25 MHz
External Data Bus Width 4 4
JESD-30 Code R-GDIP-T40 R-CDIP-T40
Length 52.324 mm
Number of Terminals 40 40
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.715 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm
uPs/uCs/Peripheral ICs Type BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR
Base Number Matches 2 1
Rohs Code No
JESD-609 Code e0
Package Equivalence Code DIP40,.6
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Supply Current-Max 10 mA
Terminal Finish TIN LEAD

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