AM29C828LMB
vs
5962-8860501KA
feature comparison
| Part Life Cycle Code |
Active
|
Contact Manufacturer
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
SRI INTERNATIONAL
|
| Package Description |
,
|
CERAMIC, FP-24
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Control Type |
ENABLE LOW
|
|
| Count Direction |
UNIDIRECTIONAL
|
|
| Family |
CMOS
|
LS
|
| JESD-30 Code |
S-CQCC-N28
|
R-GDFP-F24
|
| Length |
11.43 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Max I(ol) |
0.024 A
|
|
| Number of Bits |
10
|
10
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
28
|
24
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
INVERTED
|
TRUE
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
QCCN
|
DFP
|
| Package Equivalence Code |
LCC28,.4SQ
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
12 ns
|
9 ns
|
| Seated Height-Max |
2.54 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BIPOLAR
|
| Terminal Form |
NO LEAD
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
11.43 mm
|
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
DFP
|
| Pin Count |
|
24
|
| ECCN Code |
|
3A001.A.2.C
|
| JESD-609 Code |
|
e0
|
| Qualification Status |
|
Not Qualified
|
| Screening Level |
|
MIL-PRF-38535
|
| Temperature Grade |
|
MILITARY
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare AM29C828LMB with alternatives
Compare 5962-8860501KA with alternatives