AM42DL6402G85IT vs AM42DL6402G85IS feature comparison

AM42DL6402G85IT Spansion

Buy Now Datasheet

AM42DL6402G85IS AMD

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code BGA BGA
Package Description 8 X 11.60 MM, FBGA-73 LFBGA, BGA73,10X12,32
Pin Count 73 73
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 85 ns 85 ns
Additional Feature SRAM IS ORGANISED AS 128K X 16 SRAM ORGANISATION IS 128K X 16; FLASH IS ALSO CONFIGURABLE AS 8M X 8
JESD-30 Code R-PBGA-B73 R-PBGA-B73
JESD-609 Code e0 e0
Length 11.6 mm 11.6 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+SRAM FLASH+SRAM
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 73 73
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA73,10X12,32 BGA73,10X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Standby Current-Max 0.00001 A 0.00001 A
Supply Current-Max 0.045 mA 0.045 mA
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 3 3

Compare AM42DL6402G85IT with alternatives

Compare AM42DL6402G85IS with alternatives