AM4378BZDNA100
vs
XAM5718AABCXEA
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
BGA
|
|
Package Description |
LFBGA,
|
FBGA,
|
Pin Count |
491
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A992.C
|
|
HTS Code |
8542.31.00.01
|
|
Samacsys Manufacturer |
Texas Instruments
|
|
JESD-30 Code |
S-PBGA-B491
|
S-PBGA-B760
|
JESD-609 Code |
e1
|
e1
|
Length |
17 mm
|
23 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
491
|
760
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
FBGA
|
Package Equivalence Code |
BGA491,25X25,25
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
250
|
Seated Height-Max |
1.3 mm
|
2.96 mm
|
Supply Voltage-Max |
1.378 V
|
1.2 V
|
Supply Voltage-Min |
1.272 V
|
1.11 V
|
Supply Voltage-Nom |
1.325 V
|
1.15 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.65 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
17 mm
|
23 mm
|
uPs/uCs/Peripheral ICs Type |
SoC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
Date Of Intro |
|
2016-05-14
|
Address Bus Width |
|
16
|
Boundary Scan |
|
YES
|
Clock Frequency-Max |
|
38.4 MHz
|
External Data Bus Width |
|
32
|
Format |
|
FLOATING POINT
|
Integrated Cache |
|
NO
|
Low Power Mode |
|
YES
|
Speed |
|
1500 MHz
|
|
|
|
Compare AM4378BZDNA100 with alternatives
Compare XAM5718AABCXEA with alternatives