AM54BDS128AGT89IT vs AM42BDS640AGBD9FT feature comparison

AM54BDS128AGT89IT AMD

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AM42BDS640AGBD9FT Spansion

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SPANSION INC
Part Package Code BGA BGA
Package Description LFBGA, BGA93,10X12,32 LFBGA,
Pin Count 93 93
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 85 ns
Additional Feature SRAM IS ORGANISED AS 1M X 16 STATIC RAM IS ORGANISED AS 1M X 16
JESD-30 Code S-PBGA-B93 R-PBGA-B93
Length 10 mm 11.6 mm
Memory Density 134217728 bit 67108864 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+SRAM
Number of Functions 1 1
Number of Terminals 93 93
Number of Words 8388608 words 4194304 words
Number of Words Code 8000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA93,10X12,32
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Standby Current-Max 0.00001 A
Supply Current-Max 0.04 mA
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 10 mm 8 mm
Base Number Matches 2 1
Rohs Code Yes
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER

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