AM5K2E02XABD25
vs
AM5K2E02ABD25
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
FBGA,
|
FBGA,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A002.A
|
5A991.B.4
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Address Bus Width |
16
|
16
|
| Boundary Scan |
YES
|
YES
|
| External Data Bus Width |
64
|
64
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B1089
|
S-PBGA-B1089
|
| JESD-609 Code |
e1
|
e1
|
| Length |
27 mm
|
27 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of DMA Channels |
32
|
32
|
| Number of Terminals |
1089
|
1089
|
| On Chip Data RAM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FBGA
|
FBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
245
|
245
|
| RAM (words) |
2097152
|
2097152
|
| Seated Height-Max |
3.55 mm
|
3.55 mm
|
| Speed |
1250 MHz
|
1250 MHz
|
| Supply Voltage-Max |
1.05 V
|
1.05 V
|
| Supply Voltage-Min |
0.95 V
|
0.95 V
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
27 mm
|
27 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8542.31.00.01
|
|
|
|
Compare AM5K2E02XABD25 with alternatives
Compare AM5K2E02ABD25 with alternatives