AM99C165-55PC vs 5962-8685914LA feature comparison

AM99C165-55PC AMD

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5962-8685914LA Temic Semiconductors

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC TEMIC SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP24,.3
Pin Count 24
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 55 ns 55 ns
Additional Feature AUTOMATIC POWER-DOWN
I/O Type COMMON
JESD-30 Code R-PDIP-T24 R-GDIP-T24
JESD-609 Code e0 e0
Length 31.242 mm
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 24 24
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 16KX4 16KX4
Output Characteristics 3-STATE 3-STATE
Output Enable YES YES
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.715 mm
Standby Current-Max 0.015 A
Standby Voltage-Min 2 V
Supply Current-Max 0.11 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 2 1

Compare AM99C165-55PC with alternatives

Compare 5962-8685914LA with alternatives