AS4684NBG8
vs
NLAS4684MNR2
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
ONSEMI
|
| Part Package Code |
DFN
|
DFN10, 3x3, 0.5P
|
| Package Description |
3 X 3 MM, ROHS COMPLIANT, DFN-10
|
QFN-10
|
| Pin Count |
10
|
10
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPDT
|
SPDT
|
| JESD-30 Code |
S-XDSO-N10
|
S-XDSO-N10
|
| JESD-609 Code |
e3
|
e0
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
10
|
10
|
| Off-state Isolation-Nom |
64 dB
|
65 dB
|
| On-state Resistance Match-Nom |
0.6 Ω
|
0.06 Ω
|
| On-state Resistance-Max (Ron) |
0.8 Ω
|
1 Ω
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output |
SEPARATE OUTPUT
|
SEPARATE OUTPUT
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVSON
|
HVSON
|
| Package Equivalence Code |
SOLCC10,.11,20
|
SOLCC10,.11,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
1.8 V
|
| Supply Voltage-Nom (Vsup) |
2.7 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
30 ns
|
50 ns
|
| Switch-on Time-Max |
50 ns
|
60 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn90Pb10)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
| Manufacturer Package Code |
|
485C
|
| Factory Lead Time |
|
4 Weeks
|
| Peak Reflow Temperature (Cel) |
|
235
|
| Technology |
|
CMOS
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare AS4684NBG8 with alternatives
Compare NLAS4684MNR2 with alternatives