AS5C2568C-35/IT
vs
MB8298-35PF
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROSS COMPONENTS
FUJITSU LTD
Package Description
DIP, DIP28,.3
SOP, SOP28,.5
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
35 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-XDIP-T28
R-PDSO-G28
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP28,.3
SOP28,.5
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.02 A
0.005 A
Standby Voltage-Min
4.5 V
4.5 V
Supply Current-Max
0.15 mA
0.11 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Rohs Code
Part Package Code
SOIC
Pin Count
28
JESD-609 Code
e0
Terminal Finish
Tin/Lead (Sn/Pb)
Compare AS5C2568C-35/IT with alternatives
Compare MB8298-35PF with alternatives