AS6C1008-55SINTR vs AS6C1008-55BIN feature comparison

AS6C1008-55SINTR Alliance Memory Inc

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AS6C1008-55BIN Alliance Memory Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ALLIANCE MEMORY INC ALLIANCE MEMORY INC
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 20 Weeks
Samacsys Manufacturer Alliance Memory Alliance Memory
Access Time-Max 55 ns 55 ns
Additional Feature LG_MAX
I/O Type COMMON COMMON
JESD-30 Code R-PDSO-G32 R-PBGA-B36
Length 20.75 mm 8 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 1
Number of Terminals 32 36
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TFBGA
Package Equivalence Code SOP32,.56 BGA36,6X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 2.997 mm 1.2 mm
Standby Current-Max 0.00003 A 0.000003 A
Standby Voltage-Min 1.5 V 1.5 V
Supply Current-Max 0.06 mA 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING BALL
Terminal Pitch 1.27 mm 0.75 mm
Terminal Position DUAL BOTTOM
Width 11.303 mm 6 mm
Base Number Matches 1 2
Part Package Code BGA
Pin Count 36
Qualification Status Not Qualified

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