AS6C4008A-55TIN
vs
NMS64X8EVN30
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ALLIANCE MEMORY INC
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
TSOP1
|
DIP
|
Package Description |
8 X 20 MM, GREEN, TSOP1-32
|
DIP,
|
Pin Count |
32
|
28
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.B.2.A
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Samacsys Manufacturer |
Alliance Memory
|
|
Access Time-Max |
55 ns
|
30 ns
|
JESD-30 Code |
R-PDSO-G32
|
R-PDIP-T28
|
JESD-609 Code |
e3/e6
|
|
Length |
18.4 mm
|
34.7 mm
|
Memory Density |
4194304 bit
|
65536 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
8
|
8
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
28
|
Number of Words |
524288 words
|
8192 words
|
Number of Words Code |
512000
|
8000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
512KX8
|
8KX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSOP1
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
|
Seated Height-Max |
1.2 mm
|
3.65 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
0.5 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
8 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
Number of Ports |
|
1
|
Output Characteristics |
|
3-STATE
|
Output Enable |
|
YES
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare AS6C4008A-55TIN with alternatives
Compare NMS64X8EVN30 with alternatives