AS6C4016-55BIN vs HY62QF16201ASLM-70I feature comparison

AS6C4016-55BIN Alliance Memory Inc

Buy Now Datasheet

HY62QF16201ASLM-70I SK Hynix Inc

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ALLIANCE MEMORY INC SK HYNIX INC
Part Package Code DSBGA BGA
Pin Count 48 48
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Samacsys Manufacturer Alliance Memory
Access Time-Max 55 ns 70 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Length 8 mm
Memory Density 4194304 bit 2097152 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 262144 words 131072 words
Number of Words Code 256000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256KX16 128KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA FBGA
Package Equivalence Code BGA48,6X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm
Standby Current-Max 0.00003 A
Standby Voltage-Min 2 V
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 2.8 V
Supply Voltage-Min (Vsup) 2.7 V 2.2 V
Supply Voltage-Nom (Vsup) 3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Width 6 mm
Base Number Matches 1 1
Package Description FBGA,
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER

Compare AS6C4016-55BIN with alternatives

Compare HY62QF16201ASLM-70I with alternatives