AS7C33512NTF18A-10TQC
vs
MCM63Z918TQ7
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
QFP
|
|
Package Description |
LQFP,
|
QFP,
|
Pin Count |
100
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
10 ns
|
7 ns
|
Additional Feature |
FLOW-THROUGH ARCHITECTURE
|
FLOW-THROUGH OR PIPELINED ARCHTECTURE
|
JESD-30 Code |
R-PQFP-G100
|
R-PQFP-G100
|
JESD-609 Code |
e0
|
|
Length |
20 mm
|
22 mm
|
Memory Density |
9437184 bit
|
9437184 bit
|
Memory IC Type |
ZBT SRAM
|
ZBT SRAM
|
Memory Width |
18
|
18
|
Number of Functions |
1
|
1
|
Number of Terminals |
100
|
100
|
Number of Words |
524288 words
|
524288 words
|
Number of Words Code |
512000
|
512000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
512KX18
|
512KX18
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LQFP
|
QFP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
2.4 mm
|
Supply Voltage-Max (Vsup) |
3.465 V
|
3.465 V
|
Supply Voltage-Min (Vsup) |
3.135 V
|
3.135 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
2
|
4
|
|
|
|
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