AS7C34098-10TCN
vs
71V416S10BEG
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ALLIANCE MEMORY INC
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
TSOP2
|
CABGA
|
| Package Description |
TSOP2,
|
|
| Pin Count |
44
|
48
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
NLR
|
| HTS Code |
8542.32.00.41
|
8542320041
|
| Base Number Matches |
1
|
3
|
| Manufacturer Package Code |
|
BEG48
|
| Factory Lead Time |
|
18 Weeks
|
| Samacsys Manufacturer |
|
Renesas Electronics
|
| Access Time-Max |
|
10 ns
|
| I/O Type |
|
COMMON
|
| JESD-30 Code |
|
S-PBGA-B48
|
| JESD-609 Code |
|
e1
|
| Memory Density |
|
4194304 bit
|
| Memory IC Type |
|
STANDARD SRAM
|
| Memory Width |
|
16
|
| Moisture Sensitivity Level |
|
3
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
48
|
| Number of Words |
|
262144 words
|
| Number of Words Code |
|
256000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
256KX16
|
| Output Characteristics |
|
3-STATE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
BGA
|
| Package Equivalence Code |
|
BGA48,6X8,30
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY
|
| Parallel/Serial |
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Standby Current-Max |
|
0.02 A
|
| Standby Voltage-Min |
|
3 V
|
| Supply Current-Max |
|
0.2 mA
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
3 V
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
TIN SILVER COPPER
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.75 mm
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare AS7C34098-10TCN with alternatives
Compare 71V416S10BEG with alternatives