AS8C801825-QC75N
vs
71V67903S75PFGI8
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ALLIANCE MEMORY INC
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
QFP
|
TQFP
|
| Package Description |
14 X 20 MM, ROHS COMPLIANT, PLASTIC, MO-136DJ, TQFP-100
|
|
| Pin Count |
100
|
100
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
NLR
|
| HTS Code |
8542.32.00.41
|
8542320041
|
| Factory Lead Time |
16 Weeks
|
|
| Samacsys Manufacturer |
Alliance Memory
|
Renesas Electronics
|
| Access Time-Max |
7.5 ns
|
7.5 ns
|
| JESD-30 Code |
R-PQFP-G100
|
R-PQFP-G100
|
| Length |
20 mm
|
20 mm
|
| Memory Density |
9437184 bit
|
9437184 bit
|
| Memory IC Type |
STANDARD SRAM
|
CACHE SRAM
|
| Memory Width |
18
|
18
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
100
|
100
|
| Number of Words |
524288 words
|
524288 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
512KX18
|
512KX18
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
LQFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK, LOW PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Voltage-Max (Vsup) |
3.465 V
|
3.465 V
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
3.135 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
1
|
1
|
| Manufacturer Package Code |
|
PKG100
|
| Additional Feature |
|
FLOW-THROUGH ARCHITECTURE
|
| Clock Frequency-Max (fCLK) |
|
117 MHz
|
| I/O Type |
|
COMMON
|
| JESD-609 Code |
|
e3
|
| Output Characteristics |
|
3-STATE
|
| Package Equivalence Code |
|
QFP100,.63X.87
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Standby Current-Max |
|
0.07 A
|
| Standby Voltage-Min |
|
3.14 V
|
| Supply Current-Max |
|
0.285 mA
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare AS8C801825-QC75N with alternatives
Compare 71V67903S75PFGI8 with alternatives