AS8S512K32P-35L/XT vs WS512K32N-35H1MA feature comparison

AS8S512K32P-35L/XT Micross Components

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WS512K32N-35H1MA White Electronic Designs Corp

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROSS COMPONENTS WHITE ELECTRONIC DESIGNS CORP
Part Package Code PGA
Package Description PGA, PGA68,11X11 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Pin Count 66
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 35 ns
Additional Feature TTL COMPATIBLE INPUTS/OUTPUTS USER CONFIGURABLE AS 2M X 8
I/O Type COMMON COMMON
JESD-30 Code S-CPGA-P66 S-CPGA-P66
JESD-609 Code e0 e0
Length 27.305 mm 27.3 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 66 66
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 512KX32 512KX32
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code PGA PGA
Package Equivalence Code PGA68,11X11 PGA66,11X11
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-STD-883
Seated Height-Max 4.5974 mm 4.6 mm
Standby Current-Max 0.02 A 0.028 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.57 mA 0.66 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form PIN/PEG PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position PERPENDICULAR PERPENDICULAR
Width 27.305 mm 27.3 mm
Base Number Matches 1 3
Alternate Memory Width 16

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