AT52BR1664T-70CI vs M36W832TE85ZA1 feature comparison

AT52BR1664T-70CI Microchip Technology Inc

Buy Now Datasheet

M36W832TE85ZA1 STMicroelectronics

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC STMICROELECTRONICS
Package Description 10 X 8 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, PLASTIC, CBGA-66 12 X 8 MM, 0.80 MM PITCH, LFBGA-66
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 70 ns 85 ns
Additional Feature ALSO CONTAINS 256K X 16 SRAM SRAM IS ORGANISED AS 512K X 16
JESD-30 Code R-PBGA-B66 R-PBGA-B66
Length 10 mm 12 mm
Memory Density 16777216 bit 33554432 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+SRAM FLASH+SRAM
Number of Functions 1 1
Number of Terminals 66 66
Number of Words 1048576 words 2097152 words
Number of Words Code 1000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Equivalence Code BGA66,8X12,32 BGA66,8X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.4 mm
Supply Current-Max 0.045 mA 0.035 mA
Supply Voltage-Max (Vsup) 3.3 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 1 3
Part Package Code BGA
Pin Count 66
JESD-609 Code e0
Standby Current-Max 0.00002 A
Terminal Finish TIN LEAD

Compare AT52BR1664T-70CI with alternatives

Compare M36W832TE85ZA1 with alternatives