AT75C221-C256 vs 79RC32H434266BCI feature comparison

AT75C221-C256 Microchip Technology Inc

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79RC32H434266BCI Integrated Device Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description BGA-256 LBGA, BGA256,16X16,40
Reach Compliance Code unknown not_compliant
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 24 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 16 MHz 125 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
Length 24 mm 17 mm
Low Power Mode NO NO
Number of Terminals 256 256
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA256,20X20,50 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.34 mm 1.7 mm
Speed 40 MHz 266 MHz
Supply Voltage-Nom 1.8 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 24 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 1
Pbfree Code No
Part Package Code BGA
Pin Count 256
ECCN Code 3A991.A.2
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Integrated Cache YES
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Supply Voltage-Max 1.3 V
Supply Voltage-Min 1.1 V
Time@Peak Reflow Temperature-Max (s) 20

Compare AT75C221-C256 with alternatives

Compare 79RC32H434266BCI with alternatives