AT75C221-C256
vs
MPC604ERX180
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
ATMEL CORP
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
|
| Package Description |
BGA, BGA256,20X20,50
|
BGA, BGA255,16X16,50
|
| Pin Count |
256
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
24
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
16 MHz
|
|
| External Data Bus Width |
32
|
|
| Format |
FIXED POINT
|
|
| JESD-30 Code |
S-PBGA-B256
|
S-XBGA-B255
|
| JESD-609 Code |
e0
|
|
| Length |
24 mm
|
|
| Low Power Mode |
NO
|
|
| Number of Terminals |
256
|
255
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA256,20X20,50
|
BGA255,16X16,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.34 mm
|
|
| Speed |
40 MHz
|
180 MHz
|
| Supply Voltage-Nom |
1.8 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
24 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
4
|
|
|
|
Compare AT75C221-C256 with alternatives