AT80C51RD2-3CSLM
vs
AT80C51RD2-3CSUL
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Not Recommended
|
| Ihs Manufacturer |
ATMEL CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
GREEN, PLASTIC, DIP-40
|
| Pin Count |
40
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Core Architecture |
8051
|
|
| Device Core |
8051
|
|
| Clock Speed |
60
|
|
| Ram |
1.25
|
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
16
|
16
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
40 MHz
|
30 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
R-PDIP-T40
|
R-PDIP-T40
|
| JESD-609 Code |
e3
|
|
| Length |
51.75 mm
|
51.75 mm
|
| Number of I/O Lines |
32
|
32
|
| Number of Terminals |
40
|
40
|
| On Chip Program ROM Width |
|
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM (words) |
0
|
0
|
| ROM Programmability |
ROMLESS
|
ROM LESS
|
| Seated Height-Max |
5.08 mm
|
5.08 mm
|
| Speed |
40 MHz
|
30 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2.7 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
15.24 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
2
|
2
|
| Boundary Scan |
|
NO
|
|
|
|
Compare AT80C51RD2-3CSUL with alternatives