AT91SAM9263-CJ
vs
AT91SAM9263-CJ
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
ATMEL CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
BGA
|
|
| Package Description |
TFBGA,
|
15 X 15 MM, 0.80 MM PITCH, GREEN, BGA-324
|
| Pin Count |
324
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
26
|
26
|
| Bit Size |
32
|
32
|
| Clock Frequency-Max |
200 MHz
|
200 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
32
|
32
|
| JESD-30 Code |
S-PBGA-B324
|
S-PBGA-B324
|
| Length |
15 mm
|
15 mm
|
| Number of I/O Lines |
160
|
160
|
| Number of Terminals |
324
|
324
|
| On Chip Program ROM Width |
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
98304
|
|
| ROM (words) |
0
|
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Speed |
200 MHz
|
200 MHz
|
| Supply Voltage-Max |
1.32 V
|
1.32 V
|
| Supply Voltage-Min |
1.08 V
|
1.08 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
15 mm
|
15 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare AT91SAM9263-CJ with alternatives
Compare AT91SAM9263-CJ with alternatives