ATECC608A-TNGTLSS-C
vs
ATECC608B-MAHCZ-T
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Package Description |
Sop, Sop8,.23
|
Hvson, Solcc8,.12,20
|
| Pin Count |
8
|
8
|
| Manufacturer Package Code |
SOIC-8
|
UDFN-8
|
| Reach Compliance Code |
Compliant
|
Compliant
|
| ECCN Code |
5A992.C
|
5A992.C
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
5 Weeks
|
6 Weeks
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-N8
|
| JESD-609 Code |
e4
|
e4
|
| Length |
4.9 Mm
|
3 Mm
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
SOP
|
HVSON
|
| Package Equivalence Code |
SOP8,.23
|
SOLCC8,.12,20
|
| Package Shape |
Rectangular
|
Rectangular
|
| Package Style |
Small Outline
|
Small Outline, Heat Sink/Slug, Very Thin Profile
|
| Seated Height-Max |
1.75 Mm
|
0.6 Mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2 V
|
2 V
|
| Surface Mount |
Yes
|
Yes
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Industrial
|
Industrial
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
Gull Wing
|
No Lead
|
| Terminal Pitch |
1.27 Mm
|
0.5 Mm
|
| Terminal Position |
Dual
|
Dual
|
| Width |
3.9 Mm
|
2 Mm
|
| uPs/uCs/Peripheral ICs Type |
Cryptographic Authenticator
|
Cryptographic Authenticator
|
| Base Number Matches |
1
|
1
|
| Bus Compatibility |
|
1-Wire
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|