ATECC608A-W07DA-B
vs
ATECC608A-TNGACTS-G
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
DIE, WAFER
|
SOIC-8
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Date Of Intro |
2018-10-04
|
|
Bus Compatibility |
I2C
|
|
Clock Frequency-Max |
1 MHz
|
|
JESD-30 Code |
R-XUUC-N
|
R-PDSO-G8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Code |
DIE
|
SOP
|
Package Equivalence Code |
WAFER
|
SOP8,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
SMALL OUTLINE
|
Screening Level |
TS 16949
|
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
2 V
|
2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Position |
UNSPECIFIED
|
DUAL
|
uPs/uCs/Peripheral ICs Type |
CRYPTOGRAPHIC AUTHENTICATOR
|
CRYPTOGRAPHIC AUTHENTICATOR
|
Base Number Matches |
1
|
1
|
Length |
|
4.9 mm
|
Number of Terminals |
|
8
|
Package Body Material |
|
PLASTIC/EPOXY
|
Seated Height-Max |
|
1.75 mm
|
Terminal Pitch |
|
1.27 mm
|
Width |
|
3.9 mm
|
|
|
|
Compare ATECC608A-W07DA-B with alternatives
Compare ATECC608A-TNGACTS-G with alternatives