ATECC608A-W07DA-B
vs
ATECC608A-TNGTLSS-C
feature comparison
| Part Life Cycle Code |
Active
|
Not Recommended
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
DIE, WAFER
|
SOIC-8
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.39.00.01
|
| Date Of Intro |
2018-10-04
|
|
| Bus Compatibility |
I2C
|
|
| Clock Frequency-Max |
1 MHz
|
|
| JESD-30 Code |
R-XUUC-N
|
R-PDSO-G8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Code |
DIE
|
SOP
|
| Package Equivalence Code |
WAFER
|
SOP8,.23
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
SMALL OUTLINE
|
| Screening Level |
TS 16949
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2 V
|
2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Position |
UNSPECIFIED
|
DUAL
|
| uPs/uCs/Peripheral ICs Type |
CRYPTOGRAPHIC AUTHENTICATOR
|
CRYPTOGRAPHIC AUTHENTICATOR
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
5A992.C
|
| Length |
|
4.9 mm
|
| Number of Terminals |
|
8
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Seated Height-Max |
|
1.75 mm
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
3.9 mm
|
|
|
|
Compare ATECC608A-W07DA-B with alternatives
Compare ATECC608A-TNGTLSS-C with alternatives