ATECC608B-TCSMU vs ATECC608A-MAHA2-B feature comparison

ATECC608B-TCSMU Microchip Technology Inc

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ATECC608A-MAHA2-B Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Not Recommended
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description UDFN-8 UDFN-8
Reach Compliance Code compliant compliant
Clock Frequency-Max 1 MHz
External Data Bus Width
JESD-30 Code R-PDSO-N8 R-PDSO-N8
Length 3 mm 3 mm
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON HVSON
Package Equivalence Code SOLCC8,.12,20 SOLCC8,.12,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Seated Height-Max 0.6 mm 0.6 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 2 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 2 mm 2 mm
uPs/uCs/Peripheral ICs Type CRYPTOGRAPHIC AUTHENTICATOR CRYPTOGRAPHIC AUTHENTICATOR
Base Number Matches 1 1
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level TS 16949
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare ATECC608B-TCSMU with alternatives

Compare ATECC608A-MAHA2-B with alternatives