ATMEGA165PA-MU
vs
ATMEGA169P-16AU
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ATMEL CORP
|
ATMEL CORP
|
| Part Package Code |
QFN
|
QFP
|
| Package Description |
HVQCCN, LCC64,.35SQ,20
|
TQFP-64
|
| Pin Count |
64
|
64
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
ALSO OPERATES AT 2.7 V MINIMUM SUPPLY AT 8 MHZ AND 1.8 V MINIMUM SUPPLY AT 4 MHZ
|
ALSO OPERATES AT 2.7V SUPPLY AT 8 MHZ
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| CPU Family |
AVR RISC
|
AVR RISC
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| DAC Channels |
NO
|
YES
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQCC-N64
|
S-PQFP-G64
|
| Length |
9 mm
|
14 mm
|
| Number of I/O Lines |
54
|
54
|
| Number of Terminals |
64
|
64
|
| On Chip Program ROM Width |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
TQFP
|
| Package Equivalence Code |
LCC64,.35SQ,20
|
TQFP64,.63SQ,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
1024
|
1024
|
| ROM (words) |
8192
|
8192
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1 mm
|
1.2 mm
|
| Speed |
16 MHz
|
16 MHz
|
| Supply Current-Max |
9.5 mA
|
9.5 mA
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
2.7 V
|
| Supply Voltage-Nom |
5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
9 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
3
|
3
|
| Pbfree Code |
|
Yes
|
| Factory Lead Time |
|
4 Weeks
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare ATMEGA165PA-MU with alternatives
Compare ATMEGA169P-16AU with alternatives