ATMEGA8L-8ML
vs
ATMEGA8L-8MNR
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
ATMEL CORP
|
ATMEL CORP
|
| Part Package Code |
QFN
|
|
| Package Description |
HVQCCN,
|
,
|
| Pin Count |
32
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Core Architecture |
AVR
|
|
| Device Core |
AVR
|
|
| Clock Speed |
16
|
|
| Ram |
1
|
|
| Flash Memory |
8
|
|
| Can |
0
|
|
| Adc Channels |
8
|
|
| Adc Resolution |
10
|
|
| Has ADC |
YES
|
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
8 MHz
|
|
| DAC Channels |
NO
|
|
| DMA Channels |
NO
|
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-XQCC-N32
|
|
| JESD-609 Code |
e3
|
|
| Length |
5 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of I/O Lines |
23
|
|
| Number of Terminals |
32
|
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| PWM Channels |
YES
|
|
| Package Body Material |
UNSPECIFIED
|
|
| Package Code |
HVQCCN
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| RAM (bytes) |
1024
|
|
| ROM (words) |
8192
|
8192
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1 mm
|
|
| Speed |
8 MHz
|
16 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
3 V
|
2.7 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Width |
5 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare ATMEGA8L-8ML with alternatives