ATSAM3U1CA-CU
vs
AT89C5132-ROTIL
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ATMEL CORP
|
ATMEL CORP
|
Part Package Code |
BGA
|
QFP
|
Package Description |
9 X 9 MM, 0.80 MM PITCH, GREEN, LFBGA-100
|
TQFP-80
|
Pin Count |
100
|
80
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
|
Has ADC |
YES
|
YES
|
Address Bus Width |
24
|
16
|
Bit Size |
32
|
8
|
CPU Family |
CORTEX-M3
|
|
Clock Frequency-Max |
12 MHz
|
20 MHz
|
DAC Channels |
YES
|
NO
|
DMA Channels |
YES
|
NO
|
External Data Bus Width |
8
|
8
|
JESD-30 Code |
S-PBGA-B100
|
S-PQFP-G80
|
Length |
9 mm
|
14 mm
|
Number of I/O Lines |
96
|
44
|
Number of Terminals |
100
|
80
|
On Chip Program ROM Width |
8
|
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
NO
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
LQFP
|
Package Equivalence Code |
BGA100,10X10,32
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
20480
|
|
ROM (words) |
65536
|
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.1 mm
|
1.6 mm
|
Speed |
12 MHz
|
40 MHz
|
Supply Voltage-Max |
1.95 V
|
3.3 V
|
Supply Voltage-Min |
1.8 V
|
2.7 V
|
Supply Voltage-Nom |
1.8 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.65 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Width |
9 mm
|
14 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
1
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare ATSAM3U1CA-CU with alternatives
Compare AT89C5132-ROTIL with alternatives