ATSAM4SD32CB-CUR
vs
ATSAM4SD32CB-AN
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ATMEL CORP
|
ATMEL CORP
|
| Package Description |
TFBGA,
|
LFQFP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
24
|
24
|
| Bit Size |
32
|
32
|
| Clock Frequency-Max |
20 MHz
|
20 MHz
|
| DAC Channels |
YES
|
YES
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-PBGA-B100
|
S-PQFP-G100
|
| Length |
9 mm
|
14 mm
|
| Number of I/O Lines |
79
|
79
|
| Number of Terminals |
100
|
100
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| RAM (bytes) |
163840
|
163840
|
| ROM (words) |
2097152
|
2097152
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.1 mm
|
1.6 mm
|
| Speed |
120 MHz
|
120 MHz
|
| Supply Voltage-Max |
1.32 V
|
1.32 V
|
| Supply Voltage-Min |
1.08 V
|
1.08 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
9 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
2
|
2
|
| Samacsys Manufacturer |
|
Microchip
|
|
|
|