ATSAMD21J18A-MU
vs
STM32F091RCH6
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
STMICROELECTRONICS
|
| Package Description |
QFN-64
|
UFBGA-64
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
4 Weeks
|
13 Weeks
|
| Samacsys Manufacturer |
Microchip
|
STMicroelectronics
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
|
| CPU Family |
CORTEX-M0+
|
CORTEX-M0
|
| Clock Frequency-Max |
32 MHz
|
32 MHz
|
| DAC Channels |
YES
|
YES
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PQCC-N64
|
S-PBGA-B64
|
| Length |
9 mm
|
5 mm
|
| Low Power Mode |
YES
|
|
| Number of DMA Channels |
12
|
12
|
| Number of External Interrupts |
16
|
|
| Number of I/O Lines |
52
|
52
|
| Number of Serial I/Os |
1
|
|
| Number of Terminals |
64
|
64
|
| Number of Timers |
8
|
10
|
| On Chip Data RAM Width |
8
|
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
VFBGA
|
| Package Equivalence Code |
LCC64,.35SQ,20
|
BGA64,8X8,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
32768
|
32768
|
| ROM (words) |
262144
|
262144
|
| ROM Programmability |
FLASH
|
FLASH
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
1 mm
|
0.6 mm
|
| Speed |
48 MHz
|
48 MHz
|
| Supply Current-Max |
7 mA
|
30.3 mA
|
| Supply Voltage-Max |
3.63 V
|
3.6 V
|
| Supply Voltage-Min |
1.62 V
|
3.3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
9 mm
|
5 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
3
|
3
|
| ECCN Code |
|
3A991.A.2
|
| HTS Code |
|
8542.31.00.01
|
| Additional Feature |
|
INTERNAL 3-CH ADC IS ALSO AVAILABLE
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare ATSAMD21J18A-MU with alternatives
Compare STM32F091RCH6 with alternatives