ATSAMD51J19B-AF
vs
ATSAMD51J19B-AFT
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
TQFP-64
|
TQFP-64
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
32
|
32
|
| Clock Frequency-Max |
48 MHz
|
48 MHz
|
| DAC Channels |
YES
|
YES
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G64
|
S-PQFP-G64
|
| Length |
10 mm
|
10 mm
|
| Number of I/O Lines |
51
|
51
|
| Number of Terminals |
64
|
64
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFQFP
|
TFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
FLATPACK, THIN PROFILE, FINE PITCH
|
| ROM Programmability |
FLASH
|
FLASH
|
| Screening Level |
AEC-Q100; TS 16949
|
AEC-Q100; TS 16949
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Speed |
100 MHz
|
100 MHz
|
| Supply Voltage-Max |
3.63 V
|
3.63 V
|
| Supply Voltage-Min |
1.71 V
|
1.71 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
10 mm
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare ATSAMD51J19B-AF with alternatives
Compare ATSAMD51J19B-AFT with alternatives