ATTINY817-MZT-VAO
vs
ATTINY817-MNR
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ATMEL CORP
|
| Package Description |
VQFN-24
|
,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Date Of Intro |
2018-03-16
|
2016-09-13
|
| Has ADC |
YES
|
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
|
| CPU Family |
AVR RISC
|
|
| Clock Frequency-Max |
16 MHz
|
|
| DAC Channels |
YES
|
|
| DMA Channels |
NO
|
|
| External Data Bus Width |
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
NO
|
|
| JESD-30 Code |
S-PQCC-N24
|
|
| Length |
4 mm
|
|
| Low Power Mode |
YES
|
|
| Number of External Interrupts |
22
|
|
| Number of I/O Lines |
22
|
|
| Number of Serial I/Os |
1
|
|
| Number of Terminals |
24
|
|
| Number of Timers |
3
|
|
| On Chip Data RAM Width |
8
|
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
NO
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
HVQCCN
|
|
| Package Equivalence Code |
LCC24,.16SQ,20
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
| RAM (bytes) |
512
|
|
| RAM (words) |
512
|
|
| ROM (words) |
8192
|
8192
|
| ROM Programmability |
FLASH
|
FLASH
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
0.9 mm
|
|
| Speed |
16 MHz
|
20 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
1.8 V
|
| Supply Voltage-Nom |
5 V
|
3 V
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Form |
NO LEAD
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Width |
4 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
2
|
| Samacsys Manufacturer |
|
Microchip
|
|
|
|
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