AX500-3PQG208 vs AX500-2PQG208 feature comparison

AX500-3PQG208 Microsemi Corporation

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AX500-2PQG208 Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description FQFP, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, QFP-208
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 500000 SYSTEM GATES AVAILABLE 500000 SYSTEM GATES AVAILABLE
JESD-30 Code S-PQFP-G208 S-PQFP-G208
JESD-609 Code e3 e3
Length 28 mm 28 mm
Moisture Sensitivity Level 3 3
Number of Equivalent Gates 286000 500000
Number of Terminals 208 208
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 286000 GATES 5376 CLBS, 500000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP FQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH FLATPACK, FINE PITCH
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.1 mm 4.1 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 28 mm 28 mm
Base Number Matches 2 3
Factory Lead Time 8 Weeks
Clock Frequency-Max 870 MHz
Combinatorial Delay of a CLB-Max 0.74 ns
Number of CLBs 5376
Number of Inputs 336
Number of Logic Cells 8064
Number of Outputs 336
Package Equivalence Code QFP208,1.2SQ,20
Packing Method TRAY
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30

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