BAS216,115 vs BAS21-TP feature comparison

BAS216,115 NXP Semiconductors

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BAS21-TP Micro Commercial Components

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS MICRO COMMERCIAL COMPONENTS CORP
Package Description CERAMIC PACKAGE-2 PACKAGE-3
Pin Count 2 3
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.70 8541.10.00.70
Samacsys Manufacturer NXP
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
Forward Voltage-Max (VF) 1.25 V 1.25 V
JESD-30 Code R-CDSO-R2 R-PDSO-G3
Non-rep Pk Forward Current-Max 4 A 9 A
Number of Elements 1 1
Number of Phases 1 1
Number of Terminals 2 3
Operating Temperature-Max 150 °C 150 °C
Output Current-Max 0.25 A 0.2 A
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Power Dissipation-Max 0.4 W 0.35 W
Qualification Status Not Qualified Not Qualified
Rep Pk Reverse Voltage-Max 85 V 250 V
Reverse Current-Max 1 µA 0.1 µA
Reverse Recovery Time-Max 0.004 µs 0.05 µs
Surface Mount YES YES
Terminal Form WRAP AROUND GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 10
Base Number Matches 1 2
Pbfree Code Yes
JESD-609 Code e3
Moisture Sensitivity Level 1
Operating Temperature-Min -65 °C
Technology SCHOTTKY
Terminal Finish MATTE TIN

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