BAS21S
vs
SDR1DSMTXV
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
FORMOSA MICROSEMI CO LTD
|
SOLID STATE DEVICES INC
|
| Package Description |
PLASTIC PACKAGE-3
|
HERMETIC SEALED, SM, 2 PIN
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
8541.10.00.80
|
| Configuration |
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JESD-30 Code |
R-PDSO-G3
|
O-LELF-R2
|
| Number of Elements |
2
|
1
|
| Number of Terminals |
3
|
2
|
| Operating Temperature-Max |
150 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Current-Max |
0.225 A
|
1 A
|
| Package Body Material |
PLASTIC/EPOXY
|
GLASS
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
SMALL OUTLINE
|
LONG FORM
|
| Power Dissipation-Max |
0.225 W
|
|
| Rep Pk Reverse Voltage-Max |
250 V
|
200 V
|
| Reverse Recovery Time-Max |
0.05 µs
|
0.05 µs
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
GULL WING
|
WRAP AROUND
|
| Terminal Position |
DUAL
|
END
|
| Base Number Matches |
14
|
1
|
| Pin Count |
|
2
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
| Application |
|
GENERAL PURPOSE
|
| Case Connection |
|
ISOLATED
|
| Non-rep Pk Forward Current-Max |
|
25 A
|
| Number of Phases |
|
1
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
SCHOTTKY
|
|
|
|
Compare BAS21S with alternatives
Compare SDR1DSMTXV with alternatives