BAS321T/R
vs
BAS321
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
CHANGZHOU GALAXY CENTURY MICROELECTRONICS CO LTD
|
| Part Package Code |
SC-76
|
|
| Package Description |
R-PDSO-G2
|
SOD-323, 2 PIN
|
| Pin Count |
2
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JESD-30 Code |
R-PDSO-G2
|
R-PDSO-G2
|
| JESD-609 Code |
e3
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Output Current-Max |
0.25 A
|
0.2 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Dissipation-Max |
0.3 W
|
0.3 W
|
| Qualification Status |
Not Qualified
|
|
| Rep Pk Reverse Voltage-Max |
250 V
|
250 V
|
| Reverse Recovery Time-Max |
0.05 µs
|
0.05 µs
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Base Number Matches |
2
|
4
|
| Additional Feature |
|
LOW LEAKAGE CURRENT
|
| Application |
|
FAST RECOVERY
|
| Breakdown Voltage-Min |
|
250 V
|
| Forward Voltage-Max (VF) |
|
1.25 V
|
| Non-rep Pk Forward Current-Max |
|
1.7 A
|
| Number of Phases |
|
1
|
| Operating Temperature-Min |
|
-65 °C
|
| Reference Standard |
|
MIL-STD-202
|
| Reverse Current-Max |
|
0.1 µA
|
| Reverse Test Voltage |
|
200 V
|
|
|
|
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