BAS32L
vs
BAS32L,115
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NORTH AMERICAN PHILIPS DISCRETE PRODUCTS DIV
|
NEXPERIA
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Configuration |
SINGLE
|
SINGLE
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
0.75 V
|
|
JESD-609 Code |
e0
|
e3
|
Non-rep Pk Forward Current-Max |
2 A
|
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Operating Temperature-Max |
200 °C
|
200 °C
|
Output Current-Max |
0.2 A
|
0.2 A
|
Rep Pk Reverse Voltage-Max |
75 V
|
100 V
|
Reverse Recovery Time-Max |
0.004 µs
|
0.004 µs
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN
|
Base Number Matches |
11
|
2
|
Part Package Code |
|
MELF
|
Pin Count |
|
2
|
Manufacturer Package Code |
|
SOD80C
|
HTS Code |
|
8541.10.00.70
|
Date Of Intro |
|
1991-04-01
|
Samacsys Manufacturer |
|
Nexperia
|
Application |
|
GENERAL PURPOSE
|
Case Connection |
|
ISOLATED
|
Diode Element Material |
|
SILICON
|
JESD-30 Code |
|
O-LELF-R2
|
Moisture Sensitivity Level |
|
1
|
Number of Terminals |
|
2
|
Operating Temperature-Min |
|
-65 °C
|
Package Body Material |
|
GLASS
|
Package Shape |
|
ROUND
|
Package Style |
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
|
260
|
Power Dissipation-Max |
|
0.5 W
|
Reference Standard |
|
IEC-60134
|
Terminal Form |
|
WRAP AROUND
|
Terminal Position |
|
END
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare BAS32L,115 with alternatives
-
BAS32L,115 vs BAS32LT/R
-
BAS32L,115 vs BAS32L-T
-
BAS32L,115 vs BAS32L,135
-
BAS32L,115 vs BAS32L112
-
BAS32L,115 vs 933913910135
-
BAS32L,115 vs BAS32L/T3
-
BAS32L,115 vs BAS32L-TP
-
BAS32L,115 vs BAS32L/S
-
BAS32L,115 vs 933913910115