BAS40-04W
vs
BAS40-07
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
SIEMENS A G
|
NXP SEMICONDUCTORS
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Configuration |
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
SEPARATE, 2 ELEMENTS
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1 V
|
0.38 V
|
JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G4
|
Number of Elements |
2
|
2
|
Number of Terminals |
3
|
4
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Power Dissipation-Max |
0.25 W
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reverse Current-Max |
1 µA
|
10 µA
|
Surface Mount |
YES
|
YES
|
Technology |
SCHOTTKY
|
SCHOTTKY
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
3
|
9
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Package Description |
|
PLASTIC PACKAGE-4
|
Pin Count |
|
4
|
HTS Code |
|
8541.10.00.70
|
Samacsys Manufacturer |
|
NXP
|
Additional Feature |
|
LOW LEAKAGE CURRENT
|
Application |
|
GENERAL PURPOSE
|
Case Connection |
|
CATHODE
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Operating Temperature-Max |
|
150 °C
|
Operating Temperature-Min |
|
-65 °C
|
Output Current-Max |
|
0.12 A
|
Peak Reflow Temperature (Cel) |
|
260
|
Rep Pk Reverse Voltage-Max |
|
40 V
|
Reverse Test Voltage |
|
40 V
|
Terminal Finish |
|
Tin (Sn)
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare BAS40-04W with alternatives
Compare BAS40-07 with alternatives