BAS40X-TP
vs
CMUSH2-4TIN/LEAD
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS CORP
|
CENTRAL SEMICONDUCTOR CORP
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
8541.10.00.70
|
| Application |
FAST RECOVERY
|
FAST RECOVERY
|
| Breakdown Voltage-Min |
40 V
|
40 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1 V
|
0.75 V
|
| JESD-30 Code |
R-PDSO-F2
|
R-PDSO-F3
|
| JESD-609 Code |
e3
|
e0
|
| Moisture Sensitivity Level |
1
|
|
| Non-rep Pk Forward Current-Max |
0.6 A
|
0.6 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
3
|
| Operating Temperature-Max |
125 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-65 °C
|
| Output Current-Max |
0.2 A
|
0.2 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Dissipation-Max |
0.15 W
|
0.25 W
|
| Rep Pk Reverse Voltage-Max |
40 V
|
40 V
|
| Reverse Current-Max |
0.2 µA
|
0.5 µA
|
| Reverse Recovery Time-Max |
0.005 µs
|
0.005 µs
|
| Reverse Test Voltage |
30 V
|
25 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
SCHOTTKY
|
SCHOTTKY
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
|
| Base Number Matches |
1
|
1
|
| Date Of Intro |
|
2018-01-31
|
|
|
|
Compare BAS40X-TP with alternatives
Compare CMUSH2-4TIN/LEAD with alternatives