BAS70-04
vs
BAS70-04
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
AMERICAN POWER DEVICES INC
|
TAIWAN SEMICONDUCTOR CO LTD
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.41 V
|
0.41 V
|
| Non-rep Pk Forward Current-Max |
0.1 A
|
0.1 A
|
| Operating Temperature-Max |
150 °C
|
125 °C
|
| Output Current-Max |
0.015 A
|
0.07 A
|
| Rep Pk Reverse Voltage-Max |
70 V
|
70 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
SCHOTTKY
|
SCHOTTKY
|
| Base Number Matches |
1
|
9
|
| Rohs Code |
|
Yes
|
| Package Description |
|
ROHS COMPLIANT, PLASTIC PACKAGE-3
|
| HTS Code |
|
8541.10.00.70
|
| Samacsys Manufacturer |
|
Taiwan Semiconductor
|
| Configuration |
|
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
| Diode Element Material |
|
SILICON
|
| JEDEC-95 Code |
|
TO-236AB
|
| JESD-30 Code |
|
R-PDSO-G3
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Number of Elements |
|
2
|
| Number of Phases |
|
1
|
| Number of Terminals |
|
3
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power Dissipation-Max |
|
0.2 W
|
| Qualification Status |
|
Not Qualified
|
| Reverse Recovery Time-Max |
|
0.005 µs
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Terminal Form |
|
GULL WING
|
| Terminal Position |
|
DUAL
|
|
|
|
Compare BAS70-04 with alternatives
Compare BAS70-04 with alternatives