BAS85,115 vs BAS85/T3 feature comparison

BAS85,115 NXP Semiconductors

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BAS85/T3 Nexperia

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code MELF
Package Description HERMETIC SEALED, GLASS PACKAGE-2 O-LELF-R2
Pin Count 2
Manufacturer Package Code SOD80C
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.70 8541.10.00.70
Additional Feature ULTRA HIGH SPEED SWITCH ULTRA HIGH SPEED SWITCH
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
Forward Voltage-Max (VF) 0.8 V
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e3 e3
Moisture Sensitivity Level 1 1
Non-rep Pk Forward Current-Max 5 A
Number of Elements 1 1
Number of Phases 1 1
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Current-Max 0.2 A 0.2 A
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified
Rep Pk Reverse Voltage-Max 30 V 30 V
Reverse Current-Max 2 µA
Reverse Recovery Time-Max 0.004 µs 0.004 µs
Surface Mount YES YES
Technology SCHOTTKY SCHOTTKY
Terminal Finish Tin (Sn) TIN
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Time@Peak Reflow Temperature-Max (s) 30 30
Base Number Matches 2 2
Date Of Intro 2017-02-01

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