BAS85TRL vs BAS85,135 feature comparison

BAS85TRL YAGEO Corporation

Buy Now Datasheet

BAS85,135 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer PHILIPS COMPONENTS NXP SEMICONDUCTORS
Package Description O-LELF-R2 O-LELF-R2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.70 8541.10.00.70
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
Forward Voltage-Max (VF) 0.4 V 0.8 V
JESD-30 Code O-LELF-R2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Output Current-Max 0.2 A 0.2 A
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Qualification Status Not Qualified Not Qualified
Reverse Current-Max 2 µA 2 µA
Surface Mount YES YES
Technology SCHOTTKY SCHOTTKY
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Base Number Matches 1 2
Rohs Code Yes
Part Package Code MELF
Pin Count 2
Manufacturer Package Code SOD80C
Additional Feature ULTRA HIGH SPEED SWITCH
JESD-609 Code e3
Moisture Sensitivity Level 1
Non-rep Pk Forward Current-Max 5 A
Number of Phases 1
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 260
Rep Pk Reverse Voltage-Max 30 V
Reverse Recovery Time-Max 0.004 µs
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30

Compare BAS85TRL with alternatives

Compare BAS85,135 with alternatives