BAT54L
vs
BAT54SDWT/R13
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PAN JIT INTERNATIONAL INC
|
| Part Package Code |
DFN
|
|
| Package Description |
1 X 0.60 MM, 0.50 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC PACKAGE-2
|
R-PDSO-G6
|
| Pin Count |
2
|
6
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.70
|
|
| Configuration |
SINGLE
|
2 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.24 V
|
0.24 V
|
| JESD-30 Code |
R-PBCC-N2
|
R-PDSO-G6
|
| JESD-609 Code |
e3
|
|
| Moisture Sensitivity Level |
1
|
|
| Non-rep Pk Forward Current-Max |
0.6 A
|
|
| Number of Elements |
1
|
4
|
| Number of Phases |
1
|
|
| Number of Terminals |
2
|
6
|
| Operating Temperature-Max |
150 °C
|
125 °C
|
| Output Current-Max |
0.2 A
|
0.2 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Power Dissipation-Max |
0.25 W
|
0.225 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
30 V
|
30 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
SCHOTTKY
|
SCHOTTKY
|
| Terminal Finish |
Tin (Sn)
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Base Number Matches |
2
|
1
|
| Operating Temperature-Min |
|
-55 °C
|
| Reverse Current-Max |
|
2 µA
|
| Reverse Test Voltage |
|
25 V
|
|
|
|
Compare BAT54L with alternatives
Compare BAT54SDWT/R13 with alternatives