BAT74V
vs
BAV203GS18
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
VISHAY TELEFUNKEN
|
Package Description |
ULTRA SMALL, PLASTIC PACKAGE-6
|
GLASS, QUADROMELF-2
|
Pin Count |
6
|
2
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.70
|
8541.10.00.70
|
Configuration |
SEPARATE, 2 ELEMENTS
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
0.24 V
|
|
JESD-30 Code |
R-PDSO-F6
|
O-LELF-R2
|
JESD-609 Code |
e3
|
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
2
|
1
|
Number of Terminals |
6
|
2
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-65 °C
|
|
Output Current-Max |
0.2 A
|
0.25 A
|
Package Body Material |
PLASTIC/EPOXY
|
GLASS
|
Package Shape |
RECTANGULAR
|
ROUND
|
Package Style |
SMALL OUTLINE
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
260
|
|
Power Dissipation-Max |
0.23 W
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Rep Pk Reverse Voltage-Max |
30 V
|
250 V
|
Reverse Current-Max |
2 µA
|
|
Reverse Test Voltage |
25 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
SCHOTTKY
|
|
Terminal Finish |
Tin (Sn)
|
|
Terminal Form |
FLAT
|
WRAP AROUND
|
Terminal Position |
DUAL
|
END
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Base Number Matches |
3
|
2
|
Part Package Code |
|
MELF
|
Case Connection |
|
ISOLATED
|
Reverse Recovery Time-Max |
|
0.05 µs
|
|
|
|
Compare BAT74V with alternatives
Compare BAV203GS18 with alternatives