BAV199
vs
BAV199-Q
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS CORP
|
NEXPERIA
|
| Package Description |
PLASTIC PACKAGE-3
|
SOT-23, 3 PIN
|
| Pin Count |
3
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.70
|
|
| Samacsys Manufacturer |
MCC
|
|
| Configuration |
2 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.25 V
|
1.25 V
|
| JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
| JESD-609 Code |
e0
|
e3
|
| Number of Elements |
2
|
2
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Output Current-Max |
0.215 A
|
0.16 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
|
| Reverse Current-Max |
0.005 µA
|
0.005 µA
|
| Reverse Recovery Time-Max |
3 µs
|
3 µs
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN LEAD
|
TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
11
|
1
|
| Rohs Code |
|
Yes
|
| Additional Feature |
|
LOW LEAKAGE CURRENT
|
| Application |
|
GENERAL PURPOSE
|
| JEDEC-95 Code |
|
TO-236AB
|
| Moisture Sensitivity Level |
|
1
|
| Non-rep Pk Forward Current-Max |
|
4 A
|
| Operating Temperature-Max |
|
150 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power Dissipation-Max |
|
0.25 W
|
| Reference Standard |
|
AEC-Q101; IEC-60134
|
| Rep Pk Reverse Voltage-Max |
|
75 V
|
| Reverse Test Voltage |
|
75 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare BAV199 with alternatives
Compare BAV199-Q with alternatives